The Hong Kong University of Science and Technology (HKUST) and SEMI co-hosted the inaugural 2025 Semiconductor Innovation and Intelligent Application Summit (SIIAS) in Hong Kong, attracting over 600 leaders from the semiconductor industry. This landmark event, supported by the HKSAR Government, marked a significant milestone ahead of HKUST’s 35th anniversary celebrations.
The summit convened industry leaders, researchers, policymakers, and students from regions including the Chinese Mainland, the United States, Saudi Arabia, Germany, and Singapore. Participants explored the latest technological advancements and global strategies within the semiconductor sector, further establishing Hong Kong’s reputation as a key international hub for innovation and technology.
Strengthening Hong Kong’s Semiconductor Leadership
Prof. Tim Cheng Kwang-Ting, HKUST’s Vice-President for Research and Development, expressed gratitude for the government’s support, noting its critical role in launching this summit. He emphasized the importance of collaboration across disciplines, stating, “At HKUST, we firmly believe cross-disciplinary collaboration is the catalyst for transformative technological progress.” He highlighted the university’s commitment to advancing core technologies in third-generation semiconductors, leveraging the unique strengths of the Greater Bay Area.
Mr. Lung Chu, Corporate Vice President of SEMI, remarked on the strategic significance of hosting the summit in Hong Kong. He stated, “This event will not only expand SEMI China’s influence in Hong Kong and the global semiconductor industry but will also serve as a new engine to accelerate Hong Kong’s development as a semiconductor innovation hub.”
Showcasing Cutting-Edge Technologies and Engaging Youth
The summit featured an interactive experience zone during HKUST’s Industry Engagement Day Plus. Participants had the opportunity to engage with groundbreaking technologies developed by HKUST and HKUST (Guangzhou). Notable highlights included:
– **Smart Rehabilitation Robotic System**: A robot designed for real-time analysis of human posture and movement, enhancing precision in rehabilitation therapy.
– **Next-Generation AR Display Technology**: Micro-LED microdisplays powered by quantum dot technology, essential for the next generation of lightweight augmented reality glasses.
– **Fully Integrated Digital Sensing Chips**: Innovations that achieve a tenfold reduction in sensing area, power consumption, and cost, offering significant savings for applications in IoT, wearables, digital healthcare, and Industry 4.0.
In alignment with the HKSAR Government’s commitment to promoting STEAM education, the summit also hosted five hands-on STEM workshops for secondary school students. Over 100 young participants engaged in immersive activities, such as assembling miniature circuit components and experimenting with AI applications in coding design. These workshops aimed to inspire students’ interest in technology and nurture future leaders in the industry.
The 2025 Semiconductor Innovation and Intelligent Application Summit not only showcased the advancements within the semiconductor field but also highlighted the collaborative efforts necessary for ongoing innovation and growth in this critical sector. As Hong Kong continues to strengthen its position as a global technology hub, events like SIIAS play a pivotal role in fostering international partnerships and driving the future of semiconductor research and applications.
